| 摘要 |
<P>PROBLEM TO BE SOLVED: To make light-weight a semiconductor IC mounted module onto which an electronic component higher in height than the semiconductor IC can be mounted. <P>SOLUTION: The semiconductor IC mounted module has a substrate 101, a semiconductor IC 102 mounted onto the substrate 101, and a shielding case 104 covering the semiconductor IC 102. The worktop section of the shielding case 104 has a projection 104a provided at the part corresponding to the semiconductor IC 102, and this projection 104a is pressed against a heat radiating ground pattern 102b of the semiconductor IC 102 via a conductive paste 105. This efficiently radiates heat emitted by the semiconductor IC 102 from the heat radiating ground pattern 102b to the shielding case 104. Further, this enables the whole module to be made light-weight since an electronic component high in height can be mounted and a thick heat sink is not needed as well. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
