| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device 1 having high cooling performance without lowering the reliability of a thermoelectric module 2. SOLUTION: The thermoelectric module 2 whose performance index Z is Z>2.5×10<SP>-3</SP>/K at 0-80°C has one end face 6 mounted directly on a heat radiating board 8 via a joint layer 7. COPYRIGHT: (C)2005,JPO&NCIPI |
