| 摘要 |
PROBLEM TO BE SOLVED: To provide a method a and a device for receiving and delivering wafer by which a wafer can be received by easily suppressing a shock to a low level in receiving the wafer from a transporting device and, can stably deliver the wafer to another transporting device by easily peeling the wafer in delivering the wafer to the transporting device. SOLUTION: When the device receives the wafer W from a first transporting means 31, the device receives the wafer W on a liquid 13 or in a state where the shock is suppressed to the low level by means of a member containing the liquid 13. When the device delivers the received wafer W to a second transporting means, the device delivers the wafer W in a easily peelable state by reducing the influence of the surface tension of the liquid 13, by breaking off the contact of the wafer W with the liquid 13 or the liquid 13 contained in the member or reducing the contact area of the wafer W with the liquid 13. COPYRIGHT: (C)2005,JPO&NCIPI
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