| 摘要 |
PROBLEM TO BE SOLVED: To reduce a thickness of a sheathing resin of a chip-shape solid electrolytic capacitor to miniaturize it. SOLUTION: The chip-shape solid electrolytic capacitor includes: a capacitor element where an anode oxide film layer, a solid electrolytic layer, and a cathode drawing layer are formed on an outer surface of a valve action metal sinter having an anode introducing lead; an electrode substrate with which an anode conductive plate connected to the anode introducing lead and an anode conductive plate connected to the cathode drawing layer are integrally formed with a dielectric resin; and a resin to sheath the capacitor. The sheathing resin is formed with a resin sheet having a recess to house the capacitor element, before or after housing the capacitor element in the recess, a conductive adhesive is coated on the anode introducing lead of the capacitor element and the cathode drawing layer, and the resin sheet is covered with the electrode substrate so as to connect between the anode conductive plate of the electrode substrate and the anode introducing lead of the capacitor element as well as between the cathode conductive plate of the electrode substrate and the cathode drawing layer of the capacitor element. COPYRIGHT: (C)2005,JPO&NCIPI
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