| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which coating can be eliminated from a part being connected electrically. SOLUTION: A semiconductor chip 10 having an integrated circuit 12 and a plurality of electrodes 14 is fixed to a substrate 20 such that the electrode 14 faces the substrate 20. A wiring pattern 30 is formed on the side of the substrate 20 opposite to the semiconductor chip 10. When the wiring pattern 30 is formed, through holes 22 are formed in the substrate 20 in the regions corresponding to respective electrodes 14. The wiring pattern 30 is formed through the through hole 22 from above the electrode 14. COPYRIGHT: (C)2005,JPO&NCIPI
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