| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin molding material for sealing, which has excellent moldability such as fluidity, curability, and reduces a warpage deformation amount even in the case of a use in a group mold type one-side sealed package, and to provide an electronic part apparatus equipped with an element sealed with the same. SOLUTION: The epoxy resin molding material for sealing comprises (A) a silicon-containing polymer which contains bonds (a) and (b) of formula (a) and formula (b) in which a terminal is a functional group selected from the group consisting of R<SP>1</SP>, hydroxy group and an alkoxy group (R<SP>1</SP>s are each selected from 1-12C substituted or unsubstituted monofunctional hydrocarbon groups and all the R<SP>1</SP>s may be the same or different; X is an epoxy group-containing monofunctional organic group) and has 500-4,000 epoxy equivalent, (B) an addition reaction product between a tertiary phosphine compound and a quinone compound, (C) an epoxy resin and (D) a curing agent. COPYRIGHT: (C)2005,JPO&NCIPI
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