| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition which satisfies all of the insufficient adhesiveness, curing contractibility, heat resistance, moisture resistance, reflow resistance and migration resistance of conventional adhesives used for substrate material uses including flexible printed circuit boards. SOLUTION: This epoxy resin composition comprising an epoxy resin (a), a curing agent (b), a cross-linked rubber (c), and an ion scavenger (d) is characterized by containing an epoxy resin (A) obtained by modifying a bifunctional glycidyl ether type epoxy resin having an epoxy equivalent of 300 to 3,000 eq/g with butadiene-acrylonitrile copolymer having carboxyl groups at both the terminals in the epoxy resin (a), containing a cross-linked rubber having a reactive carboxyl group content of 0.1 to 5 mol. % as the cross-linked rubber (c), and having a ä(a)+(c)}/ä(a)+(b)+(c)} compounding weight ratio of 0.5 to 0.7. COPYRIGHT: (C)2005,JPO&NCIPI
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