| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufactured by simple manufacturing processes, a manufacturing method thereof, a circuit board, and an electronic apparatus. SOLUTION: A first layer side 22 of a sheet 20 to which a plurality of through-holes 26 are formed, the through-holes penetrating through the first layer 22 and a second layer 24 of the sheet 20, is adhered to a first side 14 of a semiconductor wafer 10 on which a plurality of electrodes 12 are formed so that each through-hole 26 is placed on each electrode 12. A solder ball 34 is inserted to each of a plurality of the through-holes 26. The first layer 22 of the sheet 20 is cut off together with the semiconductor wafer 10 from the second side 16 opposite to the first side 14. COPYRIGHT: (C)2005,JPO&NCIPI |
