| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board in which the occurrence of a short circuit between conductor patterns is suppressed, and to provide its producing process. SOLUTION: The multilayer circuit board 100 is produced by laminating two sheets of conductor pattern films 9a and 10b. A hole 3h having a rear surface connection land 2ar as its bottom is formed in the conductor pattern film 9a and filled with a conductive paste. A surface connection land 20bf consisting of a central part 20bfc and a peripheral separation part 20bfs arranged around the central part while being spaced apart therefrom is provided on the other conductor pattern film 10b. The rear surface connection land 2ar and the surface connection land 20bf are interconnected through a connection conductor 3b formed by sintering the conductive paste. Although tin contained in the conductive paste melts at the time of sintering and begins to flow, it is captured by the peripheral separation part 20bfs and absorbed. COPYRIGHT: (C)2005,JPO&NCIPI |
