发明名称 ELECTRONIC COMPONENT COOLING METHOD AND SYSTEM THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a local temperature control system considering the tendency of change in power consumption in an electronic component. SOLUTION: The local system for radiating heat generated by the electronic component (100) is provided with a controllable cooling apparatus (101) and control systems (130, 131, 132) for controlling the cooling apparatus. According to the change in power consumption in the electronic component, and it is characterised in that the control system of the local system adjusts an operating speed of the cooling apparatus. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005019992(A) 申请公布日期 2005.01.20
申请号 JP20040182372 申请日期 2004.06.21
申请人 HEWLETT-PACKARD DEVELOPMENT CO LP 发明人 CHHEDA SACHIN NEVIN;BARSUN STEPHAN KARL;EPINOZA-IBARRA RICARDO E
分类号 H05K7/20;G06F1/20;G06F1/32;H02P7/00;(IPC1-7):H05K7/20 主分类号 H05K7/20
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