WET PROCESSING DEVICE, WET PROCESSING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To suppress and prevent the formation of the elution region of a constituent atom such as a pit or the like on a semiconductor wafer. SOLUTION: In a wet processing, a plurality of semiconductor wafers 1W housed in a carrier 4 are dipped in a chemical solution EL containing fluoric acid to remove the oxide film of the semiconductor wafers 1W. Thereafter, the semiconductor wafers 1W is rinsed by using pure water, thereby washing and falling the chemical solution EL attached to the semiconductor wafers 1W. In at least the rinsing process, a light L is irradiated from a light source 3f provided in a wet etching device 3 to the semiconductor wafer 1W. An electromotive force by a battery function in a pn junction of the semiconductor wafers 1W is adjusted by adjusting a state of this light L, and the occurrence of the pit or the like is suppressed or prevented in the semiconductor wafers 1W. COPYRIGHT: (C)2005,JPO&NCIPI