发明名称 CONDUCTIVE PASTE, CIRCUIT BOARD, SOLAR CELL, AND CERAMIC CHIP ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting conductive paste that can forme an electroconductive film having excellent conductivity and adhesive property. SOLUTION: The conductive paste comprises a conductive powder, a binder resin containing a phthalic acid glycidyl ester type epoxy resin, wherein the phthalic acid glycidyl ester type epoxy resin is one or two kinds selected from a group consisting of a phthalic acid glycidyl ester, dihydro phthalic acid glycidyl ester, tetrahydro phthalic acid glycidyl ester, and hexahydro phthalic acid glycidyl ester. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005019398(A) 申请公布日期 2005.01.20
申请号 JP20040167681 申请日期 2004.06.04
申请人 SHOEI CHEM IND CO 发明人 NAKAMURA TERUO;BABA NORIHIRO;NISHIDA KOJI;ENDO TAKASHI
分类号 C08K3/00;C08G59/12;C08L63/00;H01B1/22;H05K3/12;(IPC1-7):H01B1/22 主分类号 C08K3/00
代理机构 代理人
主权项
地址