发明名称 |
Method for managing polishing apparatus |
摘要 |
A method for managing a polishing apparatus including downforce detecting means for detecting a downforce applied to a polishing target wafer, includes steps of: calculating a difference between a first downforce detected by the downforce detecting means at a first period at which the polishing apparatus stands by for polishing the wafer, and a second downforce detected by the downforce detecting means at a second period at which the polishing apparatus polishes the wafer, as an actual downforce actually applied to the wafer at the second period; and monitoring the actual downforce.
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申请公布号 |
US2005014373(A1) |
申请公布日期 |
2005.01.20 |
申请号 |
US20040891097 |
申请日期 |
2004.07.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MIYASAKA KOUTARO;IMAI SHINICHI |
分类号 |
H01L21/304;B24B21/04;B24B37/04;B24B49/16;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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