| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiating plate which can increase its heat radiating performance, simplify its manufacturing steps, and have an excellent handleability in its manufacturing steps, and also to provide a heat radiating module, a semiconductor mounted module, and a semiconductor device. SOLUTION: The heat radiating plate 1 comprises a heat sink material 2 including a metal/ceramic composite material containing a metal or ceramic dispersed therein, and ceramic boards 3 joined to both surfaces of the heat sink material 2. End faces of the heat sink material2 are extruded from end faces of the ceramic boards 3 or are flush therewith. COPYRIGHT: (C)2005,JPO&NCIPI |
