发明名称 |
CONDUCTIVE SHEET HAVING MORE THAN ONE THROUGH HOLE OR VIA HOLE |
摘要 |
<p>A conductive sheet (1) wherein conductive layers are formed directly on both sides of an insulating substrate (2), and the one or more conductive layers existing on one side are connected electrically with conductive layers existing on the other side through a through hole or a via hole (4) opened to penetrate the insulating substrate (2). The conductive sheet (1) is characterized in that on either side of the insulating substrate (2), at least one conductive layer (3a) not connected electrically with the other conductive layers (3b, 3c) on the same side is formed, and more than one through holes or via holes (4) are formed in the parts of the insulating substrate (2) where one or more conductive layers are formed.</p> |
申请公布号 |
WO2005005142(A1) |
申请公布日期 |
2005.01.20 |
申请号 |
WO2004JP09424 |
申请日期 |
2004.07.02 |
申请人 |
FCM CO., LTD.;MIURA, SHIGEKI |
发明人 |
MIURA, SHIGEKI |
分类号 |
H01L23/498;H01Q1/38;H05K1/11;(IPC1-7):B32B9/00;H01L21/60 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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