PACKAGE FOR LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a package for a light emitting diode which is reduced in mounting area on a mounting substrate and can increase the efficiency of taking out light outside, and also to provide a light emitting device using the same.

SOLUTION: The package 1 comprises a recessed portion 11 for housing a light emitting diode chip A which is formed on one face side in the thickness direction of a semiconductor silicon substrate 10. Electrodes 15a and 15b for external connection which are formed on the other face side of the silicon substrate 10, electrodes 13a and 13b for chip connection which connect the light emitting diode chip A on the inner bottom face of the recessed portion 11 for housing via gold bumps 3a and 3b, and interconnections 16a and 16b which are formed through a mounting section 12 composed of a part between the inner bottom face of the recessed portion 11 for housing and the other face of the silicon substrate 10 to connect the electrodes 13a and 13b for chip connection and the electrodes 15a and 15b for external connection. In the package 1, a reflection film 18 is formed on the internal surface of the recessed portion 11 for housing.

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