| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-speed signal circuit board which can easily reduce EMI noise, etc. and has a great advantage in increasing the productivity and reducing a cost, and also to provide a method of improving signal transmission properties of the same. SOLUTION: The high-speed signal circuit board 10 comprises: one or several ICs 14 which are high-speed signal output means and one or several ICs 16 which are high-speed signal input means; one or several high-speed signal circuits S20 and S21 for transmitting high-speed digital signals output from the ICs 14; and a substrate 12 consisting of a single layer or a plurality of layers whereon the ICs 14 and 16 and the high-speed signal circuits S20 and S21 are mounted. On the substrate 12 of the high-speed signal circuit board 10, a conductive shielding object 24 is mounted which is connected to grounds 22A and 22B, and shields a part of the substrate which is mounted with the high-signal circuits S20 and S21 with an interval H which reduces the impedance of that part of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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