METHOD OF MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To solve the problem that the dielectric breakdown voltage between patterns is deteriorated by the remaining refuse of conductive paste. SOLUTION: A method of manufacturing wiring board includes a sticking step 25 of sticking a supporting film 23 coated with an adhesive 24 to the lower surface of a screen 21 having wiring patterns formed of through holes 22, and a packing step of packing the conductive paste 26 in the through holes 22 from the upper surface of the screen 21 after the sticking step 25. Consequently, the dielectric breakdown voltage between the wiring patterns can be improved. COPYRIGHT: (C)2005,JPO&NCIPI