| 发明名称 |
Polyparaxylylene film, production method therefor and semiconductor device |
| 摘要 |
An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film.
|
| 申请公布号 |
US2005014388(A1) |
申请公布日期 |
2005.01.20 |
| 申请号 |
US20040484840 |
申请日期 |
2004.08.16 |
| 申请人 |
TAKAHASHI AKIO;SATSU YUICHI;NAKAI HARAKAZU;NAKAI YOSHIKO;KARDASH IGOR YEFIMOVICH;PEBALK ANDREI VLADIMIROVICH;CHVALUN SERGEI NICOLAEVICH;MAILYAN KAREN ANDRANIKOVICH |
发明人 |
TAKAHASHI AKIO;SATSU YUICHI;NAKAI HARAKAZU;NAKAI YOSHIKO;KARDASH IGOR YEFIMOVICH;PEBALK ANDREI VLADIMIROVICH;CHVALUN SERGEI NICOLAEVICH;MAILYAN KAREN ANDRANIKOVICH |
| 分类号 |
C08G61/02;C08J5/18;C08L65/04;H01L21/312;H01L21/76;H01L21/768;H01L49/02;H05K1/00;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
C08G61/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
