发明名称 |
Stencil mask design method and under bump metallurgy for C4 solder bump |
摘要 |
A method for the fine-pitch stencil mask design for stencil printing bumping technology for eutectic Sn/Pb and lead-free solder material is described. In the method, a reflowing enhancement layer is introduced to improve the solder quality and reduce the pitch of solder bumps. The method of forming the layer is described as well as the forming method of matching under-bump metallurgy layer. The method of stencil mask design can match various sizes and pitch of the solder bumps. The designed mask is fixed on the stencil printer to deposit the solder materials with the required patterns. This method can increase the solder paste volume to increase the height of solder bumps after the reflowing process. |
申请公布号 |
US2005014310(A1) |
申请公布日期 |
2005.01.20 |
申请号 |
US20040859089 |
申请日期 |
2004.06.03 |
申请人 |
HONG KONG UNIVERSITY OF SCIENCE & TECHNOLOGY |
发明人 |
CHAN CHINGHO PHILIP;XIAO GUOWEI DAVID |
分类号 |
H01L21/28;H01L21/44;H01L21/60;H01L21/768;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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