| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the adhesiveness of an electrode pad while preventing disconnection at the root part of wiring layers and an electrode. <P>SOLUTION: Interlayer insulation layers 20, 22, 24 and 26 on a semiconductor layer 10, the wiring layers 30, 32 and 34, and a pad wiring layer 40 consist of a pad 100 and a wiring 200. At the wiring, the pad wiring layer consisting of barrier metal layers 40a, 40c and a pad electrode layer 40b is connected with a lower layer wiring by a plurality of contact layers 70, 72 and 74. At the pad, the barrier metal layers 40a and 40c are removed corresponding to a pad opening part 60, and the bottom surface of the pad part positioned under the pad opening part is in direct and close contact with the interlayer insulation layer 26. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
