| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an exposure mask and a method for manufacturing a semiconductor device by which influences of the period occupied in an exposure apparatus on the production line can be decreased. <P>SOLUTION: In the exposure mask 1 having pattern areas A to C having specified light shielding patterns arranged into a plurality of blocks BA1, BA2, BB, BC on one light transmitting substrate 10, patterns for exposure of different layers are laid as the plurality of blocks BA1, BA2, BB, BC on the light transmitting substrate 10. The number of blocks used for the exposure in one layer is different from the number of blocks used for the exposure in another layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
