发明名称 |
IMC MOLDING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a new IMC molding method capable of enhancing the interlaminar bonding properties of a base material resin layer and a clear resin to enhance the appearance quality or surface properties of a resin molded product. SOLUTION: In the press molding of the resin molded product, a mold on the surface side of the resin molded product is set to a lower temperature as compared with a mold on the back side of the resin molded product to perform primary press molding and the clear resin is subsequently injected in the mold on the surface side of the resin molded product to be subjected to secondary press molding. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005014306(A) |
申请公布日期 |
2005.01.20 |
申请号 |
JP20030179886 |
申请日期 |
2003.06.24 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
MURAI DAISUKE;SHINOKI KAZUHIKO;SAWADA HIROSHI;SAKAMOTO MAKOTO;HASEGAWA ATSUSHI |
分类号 |
B29C43/14;B29C43/20;B29K105/06;B29L31/10;(IPC1-7):B29C43/14 |
主分类号 |
B29C43/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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