| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooler capable of cooling a heat generating body, e.g. a semiconductor device, more positively. SOLUTION: The cooler comprises: an evaporator 2 thermally coupled with a semiconductor device 1 and evaporating refrigerant liquid introduced to the inside; a condenser 4 for introducing refrigerant vapor from the evaporator 2 and condensing it by cooling through a radiation fan 3; a first refrigerant transfer tube 5 for transferring the refrigerant liquid condensed by the condenser 4 to the evaporator 2; a second refrigerant transfer tube 6 for transferring refrigerant vapor evaporated by the evaporator 2 to the condenser 4; and a refrigerant pump 7 provided in the way of the first refrigerant transfer tube 5 in order to transfer the refrigerant liquid from the condenser 4 to the evaporator 2. Furthermore, a tube 8 for bypassing the refrigerant pump 7 is provided in the way of the first refrigerant transfer tube 5, and a solenoid open/close valve 9 being opened by means of a controller 12 upon detecting an abnormality in the refrigerant pump 7 is provided in the way of the refrigerant bypass tube 8. COPYRIGHT: (C)2005,JPO&NCIPI
|
