发明名称 Electronic module has an injection-molded wiring block or circuit support with contacts for externally mounted components and internal wiring for connecting the various components
摘要 Electronic module (25) has a number of components (1-6) mounted on a wiring block (9). The wiring block has a number of outer sides (11-14) and contains internal connection leads (15) that connect external contact surfaces (10) on the outer sides of the block with each other. The contact surfaces connect to the contacts (7) of the components mounted on the block, : Independent claims are also included for the following:- (a) a device for manufacturing an electronic module and; (b) a method for manufacturing an electronic module in which a wiring block is produced by plastic injection molding and then contancts and components added to the raw plastic block.
申请公布号 DE10329143(A1) 申请公布日期 2005.01.20
申请号 DE2003129143 申请日期 2003.06.27
申请人 INFINEON TECHNOLOGIES AG 发明人 KERLER, RUDOLF;EURSKENS, WOLFRAM;PAPE, HEINZ;STROBEL, PETER;STOECKL, STEPHAN;BAUER, MICHAEL
分类号 H05K1/00;H05K1/18;H05K3/10;H05K3/46 主分类号 H05K1/00
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