| 摘要 |
The invention is an improved heat sink, which is mounted onto a CPU processor, comprising a base plate (20) in contact with the processor (5), a conducting column (10) located above the processor (5) on the surface of the said base plate (20) facing away the said processor (5), and a plurality of dividing walls (40) extending from the said conducting column (10), wherein the dividing walls (40) have fins (30) to help in the dissipation of heat. |
