| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of sealing semiconductor electronic component with resin by which the retention of bubbles in the vicinity of a substrate can be prevented surely while a semiconductor electronic component mounted on the substrate is sealed with a fluid resin at the time of sealing the component with the resin. <P>SOLUTION: This method of sealing semiconductor electronic component with resin includes a step of removing a resin-sealed semiconductor electronic component 22 from a stencil 1 by lowering a table 10, and a step of housing a new semiconductor electronic component 22 in a through hole 2 by again raising the table 10. At the time of raising the table 10, the raising speed of the table 10 is decreased after the table 10 is raised until the electronic component 22 approaches the through hole 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
