SEMICONDUCTOR MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device which surely picks up a prescribed workpiece while being a simple constitution, and realizes miniaturization and a low cost of the device. SOLUTION: The semiconductor manufacturing device has: a mounting part which has a plurality of suction holes for absorbing a plurality of workpieces; an air flow path for connecting a suction means for depressurizing the plurality of suction holes at once and the plurality of suction holes; a placing part where the plurality of works are absorbed in a prescribed arrangement via the plurality of suction holes; a switch valve which is provided to the air flow path and utilizes an AND circuit which switches the suction means and the plurality of suction holes independently in the state of connection; and disconnection and an absorption control mechanism which controls the switching valve provided to the air flow path of the prescribed workpiece corresponding to coordinate information showing the position of a prescribed work of the plurality of workpieces. COPYRIGHT: (C)2005,JPO&NCIPI