| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer transfer device for which the groove of a wafer transporting body and the comb-teeth of a comb-teeth member can be relatively easily aligned with each other with little effort, and, in addition, which has no possibility of scratching, cracking, etc., wafers even when the wafers are deformed, or the like; and to provide a method of manufacturing semiconductor device using the transfer device. SOLUTION: The wafer transfer device which transfers a plurality of semiconductor wafers 51 held in a state where the wafers 51 are erected in the grooves 52 of a carrier 53 between the carrier 53 and a boat to the boat, by using first and second wafer elevating/lowering machines provided with the comb-teeth members 31 which hold the wafers 51 and a wafer clamping and transferring machine. The first and second wafer elevating/lowering machines provided correspondingly to the carrier 53 and boat are provided with position correcting mechanisms 30, which correct the positions of the comb-teeth openings 34 of comb-teeth materials 32 and 33 provided in the comb-teeth members 31 in accordance with the semiconductor wafers 51 housed in the grooves 52 of the carrier 53. COPYRIGHT: (C)2005,JPO&NCIPI |
