发明名称 METAL-CLAD LAMINATED PLATE WITH INTERNAL CIRCUIT, MULTILAYER PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING THEM
摘要 PROBLEM TO BE SOLVED: To provide a metal-clad laminated plate with an internal circuit, wherein the insides of IVHs are filled up well by plating that is excellent in working environment and deposition speed, and to provide a multilayer printed wiring board and methods of manufacturing them. SOLUTION: The method of manufacturing the multilayer printed wiring board comprises processes of applying catalytic nucleuses of electroless plating on the surface of a metal-clad laminated plate, forming circuit conductors on a metal-clad laminated plate, and providing an insulating layer on the surface of the metal-clad laminated plate including the circuit conductors formed thereon. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005019517(A) 申请公布日期 2005.01.20
申请号 JP20030179423 申请日期 2003.06.24
申请人 HITACHI CHEM CO LTD 发明人 ITO TOYOKI
分类号 H05K3/18;H05K3/24;H05K3/38;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/18
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