发明名称 INTEGRATED CIRCUIT WITH INTERFACE TILE FOR COUPLING TO A STACKED -DIE SECOND INTEGRATED CIRCUIT
摘要 A general purpose interface tile of a first integrated circuit includes a plurality of micropads. A second integrated circuit may be stacked on the first integrated circuit such that signals from the second integrated circuit are communicated through the micropads and the interface tile to other circuitry on the first integrated circuit. Similarly, signals from the first integrated circuit are communicated through the interface tile and the micropads to the second integrated circuit. In the event that the first integrated circuit is a programmable logic device having a programmable interconnect structure, the interface tile is part of and hooks into the programmable interconnect structure and provides a general purpose mechanism for coupling signals from the second integrated circuit to the programmable interconnect structure and/or for coupling signals from the programmable interconnect structure to the second integrated circuit.
申请公布号 WO2005006556(A2) 申请公布日期 2005.01.20
申请号 WO2004US20688 申请日期 2004.06.24
申请人 XILINX, INC. 发明人 NEW, BERNARD, J.;CONN, ROBERT, O.;YOUNG, STEVEN, P.;YOUNG, EDEL, M.
分类号 H01L21/60;H01L23/544;H01L25/065;H03K19/177 主分类号 H01L21/60
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