| 摘要 |
FIELD: electronic engineering including thin-film microelectronics. ^ SUBSTANCE: proposed method includes evaporation of resistive layers on flexible insulating substrate and formation of strain-sensing elements of resistive-strain sensor using photolithography method, their resistance being measured in the course of adjusting temperature-compensated resistance of resistive-strain sensor by means of ohmmeter connected to respective contact pads. Resistive-strain sensor is manufactured from two resistive materials differing in value and sign of temperature-compensated resistance; two series-connected strain-sensing elements are formed on substrate, their integrated leads are connected to contact pad disposed on one end of substrate, and two remaining leads are connected to contact pads disposed in immediate proximity on other end of substrate; temperature compensation is effected by laser adjustment of resistance ratios of sensing elements having previously determined method for electrical connection of different strain-sensing elements. After that contact pads disposed in immediate proximity are connected by resistance welding or soldering for their parallel connection and use is made of two leads connected to contact pads disposed close to substrate on one end as resistive-strain sensor leads for their series connection. ^ EFFECT: enhanced precision of temperature compensation; facilitated manufacture Of temperature-compensated resistive-strain sensor. ^ 1 cl, 1 dwg |
