| 摘要 |
Disclosed is a method for manufacturing a composite member comprising a porous substrate (1), a via (8), and a wiring (9). The method comprises exposing a first region (6) and a second region (7) in the porous substrate (1) carring a photosensitive composition (2) to a exposure beam (10) through a mask (3), the second region (7) exposedby the exposure beam (10) not more than 50% of the exposure of the first region (6), the exposure beam (10) having the wavelength that an average size of voids of the porous substrate is, as expressed by a radius of gyration, 1/20 to 10 times, and forming the via (8) and the wiring (9) by infiltrating a conductive material into the first region (6) and the second region (7) respectively. <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> |
