| 摘要 |
A light emitting diode includes a casing having a concave surface, a reflecting surface formed by depositing a metallic layer on a concave surface thereof, and a lead having a light emitting element fitted thereto so as to confront the reflecting surface. A cationic polymerization type transparent epoxy resin is filled within a cavity of the casing having the concave surface, and the resin is hardened while the resin, the reflecting surface and the casing form a sandwich structure. With this construction, the light emitting diode is provided, in which neither wrinkling nor cracking occur in the reflecting surface. In addition, there is no possibility of the reflecting surface being flawed during the handling and transportation. Also, even in a reflow furnace operation in which a soldering is carried out, thermal deformation including formation of wrinkling and cracking in the reflecting surface can be completely avoided. Yet, since the cationic polymerization type transparent epoxy resin has so low a rate of shrinkage after hardening that the planarity of a light radiating surface after the hardening can be maintained and, for this reason, rays of light emerging from the light radiating surface can be emitted to the outside without being refracted at the interface between the light radiating surface and the outside. <IMAGE> |
