发明名称 NON-SILICONE CONDUCTIVE PASTE FOR THE ELECTRICAL INDUSTRY, AND ITS USE
摘要 <p>A conductive paste based on an elastomer of the polyoxypolyolefin type or on a member of the polyolefin family is described, provided with an admixture of conductive particles for the production, in the electronics industry, of a sealing element, of a contact element or of a heat-conduction element. This material is particularly suitable for the production of EMI-RFI gaskets, and, compared with materials known hitherto and based on silicone, has improved performance characteristics and environmental properties.</p>
申请公布号 EP1240648(B8) 申请公布日期 2005.01.19
申请号 EP20000985043 申请日期 2000.11.16
申请人 LAIRD TECHNOLOGIES, INC. 发明人 AIT EL CADI, MOHAMED;DUCROS, JEAN-ALEC
分类号 H05K9/00;C08K3/08;H01B1/00;H01B1/20;H01B1/22;H01B1/24;H01R13/24;H01R13/658;H01R13/6598;H05K1/09;(IPC1-7):H01B1/20;H01R4/64;C08L21/00;C08K3/04 主分类号 H05K9/00
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