发明名称 |
Manufacturing method for conductive layer wiring, layered structure member, electro-optic device, and electronic apparatus |
摘要 |
A first liquid including a first metal particle is disposed on the base board (11) via a liquid ejecting section (10) so as to form a conductive layer wiring (W2) having a predetermined pattern on a base board (11). A surface of the base board (11) is treated so as to be liquid-repellent. A second liquid which is different from a first liquid is disposed on the base board (11) by a liquid ejecting section (10) in advance. Thus, an interlayer (W1) which can improve an adhesion between the base board (11) and the conductive layer wiring (W2) is formed. By doing this, a method for forming a conductive layer wiring for realizing a finer width in the conductive layer wiring and enhancing an adhesion between the base board and the conductive layer wiring can be provided. <IMAGE> <IMAGE> <IMAGE> |
申请公布号 |
EP1357772(A3) |
申请公布日期 |
2005.01.19 |
申请号 |
EP20030252478 |
申请日期 |
2003.04.17 |
申请人 |
SEIKO EPSON CORPORATION;ULVAC, INC. |
发明人 |
FURUSAWA, MASAHIRO;HIRAI, TOSHIMITSU;ODA, MASAAKI;IWASHIGE, HISASHI |
分类号 |
G02F1/1343;G02F1/1345;G02F1/1362;H01J9/02;H01L51/40;H05K3/12 |
主分类号 |
G02F1/1343 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|