| 摘要 |
Device ( 1 ) and method for testing an electronic component ( 21 ), which device comprises a testing mechanism ( 2 ) and a mounting mechanism ( 3 ) comprising a component contact surface ( 14 ) on a side remote from the testing mechanism ( 2 ), wherein the component contact surface is provided with a vacuum chamber connected to a vacuum means ( 19 ). The mounting mechanism is provided with a heating element ( 24 ), by means of which the component contact surface can be heated.
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