发明名称 Temperature curable compositions with low temperature impact strength modifier
摘要 <p>Epoxy resin composition containing an epoxide-terminated polymer with urethane groups which also contains at least one aromatic structural element linked to the polymer chain by urethane groups. Compositions containing (A) epoxide adduct(s) with more than 1 epoxide group, (B) polymer(s) of formula (I) with at least one aromatic structural element which is linked to the polymer chain by urethane groups, (C) thixotropy modifier(s) based on urea derivatives, in a non-diffusing carrier material and (D) heat-activated epoxy resin hardener(s). [Image] Y 1an n-valent residue of an isocyanate-terminated linear or branched polyurethane prepolymer (after removing the terminal NCO groups); Y 2a residue of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide with a prim. or sec. hydroxyl group (after removing the OH and epoxide groups); m : 1, 2 or 3; n : 2, 3 or 4. Independent claims are also included for: (1) epoxide group-terminated impact modifiers of formula (I) (2) a method for bonding heat-stable materials, especially metals, with a composition as defined above which is then hardened at 100-220 (preferably 120-200) [deg] C.</p>
申请公布号 EP1498441(A1) 申请公布日期 2005.01.19
申请号 EP20030016146 申请日期 2003.07.16
申请人 SIKA TECHNOLOGY AG 发明人 KRAMER, ANDREAS;FINTER, JUERGEN;GERBER, ULRICH
分类号 C07D303/24;C08G18/10;C08G18/48;C08G18/73;C08G59/22;C08G59/32;C09J175/04;(IPC1-7):C08G18/10;C08G18/28;C08G59/28 主分类号 C07D303/24
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