发明名称 |
Methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing |
摘要 |
CMP methods reduce a cause of differences between an edge profile of a chemical mechanical polished edge of a wafer and a center profile of a chemical mechanical polished central portion of the wafer within the edge. The wafer is mounted on a carrier surface of a wafer carrier so that a wafer axis of rotation is gimballed for universal movement relative to a spindle axis of rotation of a wafer spindle. An operation using a retainer ring limits wafer movement on the carrier surface perpendicular to the wafer axis. Another operation limits a direction of permitted movement between the wafer carrier and the retainer ring to only movement parallel to the wafer axis, so that a wafer plane and a retainer ing may be co-planar.
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申请公布号 |
US6843707(B2) |
申请公布日期 |
2005.01.18 |
申请号 |
US20030717096 |
申请日期 |
2003.11.18 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
SALDANA MIGUEL ANGEL;WILLIAMS DAMON VINCENT |
分类号 |
B24B37/04;B24B37/16;B24B37/32;B24B41/06;H01L21/304;(IPC1-7):B24B7/19 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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