| 摘要 |
An in-substrate selective electrochemical treatment system for finding and repairing pinholes of an active substrate including holding an insulating substrate having a conductive pattern, supplying a predetermined amount of a specified chemical solution to a specified region on the insulating substrate and confining it in the specified region, locating the reversed polarity electrode plate close to the insulating substrate such that the reversed polarity electrode plate comes in contact with the chemical solution on the upper surface of the insulating substrate, bringing the electrode into contact with the conductive pattern in the periphery of the insulating substrate, applying a specified direct current between the electrode and the reversed polarity electrode plate, and measuring a value of current flowing between the electrode and the reversed polarity electrode plate.
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