发明名称 Production method of III nitride compound semiconductor, and III nitride compound semiconductor element based on it
摘要 A GaN layer 32 grows in vertical direction on a GaN layer 31 where neither a first mask 41m nor a second mask 42m is formed. When thickness of the GaN layer 32 becomes larger than that of the first mask 41m, it began to grown in lateral direction so as to cover the first mask 41m. Because the second mask 42m is not formed on the upper portion of the first mask 41m, the GaN layer 32 grows in vertical direction. On the contrary, at the upper region of the GaN layer 31 where the mask 41m is not formed, the second mask 42m is formed like eaves, the growth of the GaN layer 32 stops and threading dislocations propagated with vertical growth also stops there. The GaN layer 32 grows in vertical direction so as to penetrate the region where neither the first mask 41m nor the second mask 42m is formed. When the height of the GaN layer 32 becomes larger than that of the second mask 42m, the GaN layer 32 begins to grow in lateral direction again and covers the second mask 42m. After the GaN layer 32 completely covers the second mask 42m, it began to grow in vertical direction.
申请公布号 US6844246(B2) 申请公布日期 2005.01.18
申请号 US20030472261 申请日期 2003.11.05
申请人 TOYODA GOSEI CO., LTD. 发明人 NAGAI SEIJI;TOMITA KAZUYOSHI;KODAMA MASAHITO
分类号 H01L21/20;H01L21/205;H01L33/32;H01S5/323;H01S5/343;(IPC1-7):H01L21/20 主分类号 H01L21/20
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