发明名称 |
Sealing resin, resin-sealed semiconductor and system-in-package |
摘要 |
Sealing resin comprising a resin component and filler mixed in the resin component, the filler having grain size distribution with a plurality of grain size peaks. The complex internal structure can be filled with the sealing resin including the filler particles with the plurality of the filler distribution peaks.
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申请公布号 |
US6844633(B2) |
申请公布日期 |
2005.01.18 |
申请号 |
US20020210770 |
申请日期 |
2002.08.01 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
TAKADO TSUMORU |
分类号 |
H01L23/29;(IPC1-7):H01L23/29 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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