| 摘要 |
Systems and methods for limiting capacitance increase due to dummy fill metals utilized to improve planar profile uniformity are disclosed. A computer-automated method for locating dummy fills in an integrated circuit fabrication process generally comprises reading a layout file specifying layout of the integrated circuit, designating at least one net of the integrated circuit as a critical net, the critical nets being only a subset of all nets of the integrated circuit, identifying metal conductors corresponding to each designated critical net from the layout file, delineating a net blocking exclusion zone extending a distance of a minimum net blocking distance (NBD) from the metal conductor for each metal conductor identified, and locating the dummy fills outside of the net blocking exclusion zone.
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