发明名称 Method of forming a semiconductor device with a junction termination layer
摘要 A method and apparatus are provided for improving a breakdown voltage of a semiconductor device. The method includes the steps of coupling an electrode of the silicon-carbide diode to a drift layer of the semiconductor device through a charge transfer junction, said drift layer being of a first doping type and providing a junction termination layer of a relatively constant thickness in direct contact with the drift layer of the semiconductor device and in direct contact with an outside edge of the charge transfer junction, said junction termination layer extending outwards from the outside edge of the charge transfer junction, said junction termination layer also being doped with a doping material of a second doping type in sufficient concentration to provide a charge depletion region adjacent the outside edge of the charge transfer junction when the charge transfer junction is reverse biased.
申请公布号 US6844251(B2) 申请公布日期 2005.01.18
申请号 US20020104945 申请日期 2002.03.22
申请人 SHENAI KRISHNA 发明人 SHENAI KRISHNA;TRIVEDI MALAY;NEUDECK PHILIP
分类号 H01L21/04;H01L29/24;H01L29/861;H01L29/872;(IPC1-7):H01L21/28;H01L21/44 主分类号 H01L21/04
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