METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR FABRICATING APPARATUS USED THEREIN TO IMPROVE THROUGHPUT OF DICING PROCESS IN ASSEMBLING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for fabricating a semiconductor device is provided to improve throughput of a dicing process in assembling a semiconductor device by including the first process unit in which an image pick-up unit capable of recognizing a recognition mark of multiple arrangement substrate is installed and by including the second process unit for dicing the multiple arrangement substrate by a blade based upon the information acquired by alignment in the first process unit. CONSTITUTION: A plurality of multiple arrangement substrates(7) are prepared. A plurality of semiconductor chips are mounted on the plurality of multiple arrangement substrates. The plurality of semiconductor chips mounted on the plurality of multiple arrangement substrates are resin-sealed. An image recognition process is performed on the first multiple arrangement substrate. While the first multiple arrangement substrate is reorganized by dicing, an image recognition process is performed on the second multiple arrangement substrate.