发明名称 |
FILM BULK ACOUSTIC RESONATOR FABRICATED BY USING LOCOS PROCESS AND METHOD FOR MANUFACTURING THE SAME, ESPECIALLY UTILIZING POLYSILICON OXIDE LAYER AS ETCHING STOP LAYER |
摘要 |
PURPOSE: A film bulk acoustic resonator fabricated by using a LOCOS process and a method for manufacturing the same are provided to easily manufacture the FBAR of an air gap structure with an excellent and stable effective bandwidth. CONSTITUTION: A film bulk acoustic resonator fabricated by using a LOCOS process includes a substrate(100), a pair of poly silicon oxide layers(140a,140b), a membrane layer(130) and a stacked resonator(200). The insulation layer is deposited on the top surface of the substrate. The poly silicon oxide layers are deposited on both sides of the insulation layer except a predetermined portion. The membrane layer is positioned between the poly silicon oxide layers with interval from the top surface of the insulation layer by a predetermined distance. And, the stacked resonator is positioned on top of the membrane layer. |
申请公布号 |
KR20050006996(A) |
申请公布日期 |
2005.01.17 |
申请号 |
KR20030046997 |
申请日期 |
2003.07.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, SANG ON;HA, BYEOUNG JU;HWANG, JUN SIK;PARK, YUN KWON;SONG, IN SANG |
分类号 |
H03H9/24 |
主分类号 |
H03H9/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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