发明名称 FILM BULK ACOUSTIC RESONATOR FABRICATED BY USING LOCOS PROCESS AND METHOD FOR MANUFACTURING THE SAME, ESPECIALLY UTILIZING POLYSILICON OXIDE LAYER AS ETCHING STOP LAYER
摘要 PURPOSE: A film bulk acoustic resonator fabricated by using a LOCOS process and a method for manufacturing the same are provided to easily manufacture the FBAR of an air gap structure with an excellent and stable effective bandwidth. CONSTITUTION: A film bulk acoustic resonator fabricated by using a LOCOS process includes a substrate(100), a pair of poly silicon oxide layers(140a,140b), a membrane layer(130) and a stacked resonator(200). The insulation layer is deposited on the top surface of the substrate. The poly silicon oxide layers are deposited on both sides of the insulation layer except a predetermined portion. The membrane layer is positioned between the poly silicon oxide layers with interval from the top surface of the insulation layer by a predetermined distance. And, the stacked resonator is positioned on top of the membrane layer.
申请公布号 KR20050006996(A) 申请公布日期 2005.01.17
申请号 KR20030046997 申请日期 2003.07.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, SANG ON;HA, BYEOUNG JU;HWANG, JUN SIK;PARK, YUN KWON;SONG, IN SANG
分类号 H03H9/24 主分类号 H03H9/24
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