METHOD FOR FORMING RESIST PATTERN USING INK-JET NOZZLE PART IN FABRICATING SEMICONDUCTOR DEVICE TO REDUCE FABRICATING COST AND RAPIDLY PERFORM PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for forming a resist pattern using an ink-jet nozzle part in fabricating a semiconductor device is provided to reduce fabricating cost by eliminating the necessity of exposure equipment and a photoresist coating process, and to rapidly perform a process for fabricating a semiconductor device by decreasing the number of process steps. CONSTITUTION: A resist storing part(35) is formed in the body part(33) of an ink-jet nozzle part(30), and an exhaust pipe(37) for flowing resist(35a) is installed in the bottom surface of the ink-jet nozzle part. A thin film resistor(31) is installed in the back surface of the ink-jet nozzle part. The resist storing part is filled with liquid resist of an ultra-thin layer type. Current flows to the thin film resistor in the back surface of the ink-jet nozzle part to generate resistive heat. The inner pressure of the resist storing part is increased through the generation of resistive heat, and the liquid-type resist in the resist storing part spouts from the exhaust pipe to form a desired resist pattern(39) on a semiconductor wafer(41).