POSITIVE TYPE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION COMPRISING POLYMER COMPRISING STRUCTURAL REPEATING UNIT, AT LEAST TWO KINDS OF PHOTOACID GENERATORS AND ALKOXYMETHYL GROUP-CONTAINING COMPOUND

摘要

PURPOSE: Provided is a positive type photosensitive resin precursor composition which can be developed with an alkali developer, is excellent in the stability of leaving after exposure and shows a high sensitivity and a good adhesion to a substrate. CONSTITUTION: The photosensitive resin precursor composition comprises a polymer comprising a structural unit represented by the formula 1 as a main component; at least two kinds of photoacid generators; and an alkoxymethyl group-containing compound, wherein R1 is a divalent to octavalent organic group having at least two carbon atoms; R2 is a divalent to hexavalent organic group having at least two carbon atoms; R3 is H or a C1-C20 organic group; n is a number of 10-100,000; m is an integer of 0-2; p and q are an integer of 0-4 ; and p+q>0. Preferably at least one kind of photoacid generator is a quinonediazide compound, and at least one kind of photoacid generator is at least one selected from a sulfonium salt, a phosphonium salt and a diazonium salt.