ELECTRONIC COMPONENT PICKUP APPARATUS, ELECTRONIC COMPONENT PICKUP METHOD AND ELECTRONIC COMPONENT PICKUP PROGRAM FOR PICKING UP ELECTRONIC COMPONENT FROM ADHESIVE SHEET IRRESPECTIVE OF ADHESIVE STRENGTH

摘要

PURPOSE: An electronic component pickup apparatus, an electronic component pickup method, and an electronic component pickup program are provided to pick up an electronic component from an adhesive sheet irrespective of adhesive strength by separating the electronic component from an adhering side of the adhesive sheet by a pin. CONSTITUTION: A sheet plate(50) is installed at a backside of an absorbing side of an adhesive sheet and includes an absorbing hole to absorb the adhesive sheet. A pushing unit(40) is arranged at the absorbing side of the adhesive sheet to push the adhesive sheet. A lifting unit(40) is used for separating the electronic component from the adhesive sheet by lifting an electronic component from the absorbing side of the adhesive sheet by a pin.