| 摘要 |
A vertical heat treatment apparatus for semiconductor wafers (W) includes a heat treating furnace (19) which is heated to 600 DEG C or higher. In the heat treating furnace (19), the wafers (W) are subjected to batch treatment while they are placed on a boat (16). To the lower side of the heat treating furnace (19), a preparatory vacuum chamber (102) is airtightly connected. Disposed in the preparatory vacuum chamber (102) are a horizontally transfer mechanism (201) and a vertical transfer mechanism (202) for transferring the boat (16). The two transfer mechanisms (201 and 202) are supported by support members (29a and 33a) mounted on a mechanical base (28). The preparatory vacuum chamber (102) and the support members (29a and 33a) are airtightly connected to each other by means of bellows. <IMAGE>
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